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SMD Module · ESP32-C3-MINI-1
ActiveRISC-V Wi-Fi + BLE 5 Module
ESP32-C3-MINI-1
Espressif Systems · SMD Module · RISC-V Wi-Fi + BLE 5 Module
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Overview
The ESP32-C3-MINI-1 is Espressif's compact answer to the ESP8266 installed base: a 13.2 x 16.6 x 2.4 mm module with 53 castellated pads, an on-board PCB antenna and an ESP32-C3 SoC that carries 4 MB of flash inside the chip package. The SoC is a single-core 32-bit RISC-V processor clocked up to 160 MHz with 400 KB of SRAM (16 KB reserved for cache), 384 KB of ROM and 8 KB of RTC SRAM, plus IEEE 802.11 b/g/n Wi-Fi in the 2.4 GHz band (2412-2484 MHz channels, 1T1R up to 150 Mbps) and Bluetooth 5 LE including Long Range, mesh, advertising extensions and channel-selection algorithm 2. Up to 15 GPIO are available with three strapping pins, and the peripheral list includes SPI, UART, I2C, I2S, a remote-control peripheral, LED PWM controller, general DMA, a TWAI controller compatible with CAN 2.0, USB Serial/JTAG, a SAR ADC, temperature sensor and watchdog timers.
Two design details drive most support tickets. First, power: the module needs 3.0 V to 3.6 V, and transmit peaks are substantial - around 350 mA at 20.5 dBm in 802.11b and roughly 340 mA for Bluetooth LE at 20 dBm - so the supply and decoupling network must be designed for those bursts, not for the 82 mA receive figure. Second, chip revision: Espressif lists the v0.4 chip parts (ESP32-C3-MINI-1-N4 and -H4) as not recommended for new designs and recommends the v1.1 parts (-N4X and -H4X), which also differ in ambient rating (-40 C to 85 C versus -40 C to 105 C). The -H8X variant carries 8 MB of flash if your firmware plus OTA images need the room. The MINI-1U sibling swaps the PCB antenna for an external connector in a slightly shorter 13.2 x 12.5 mm body.
Authenticity checks matter because low-cost RISC-V Wi-Fi modules attract copies assembled with used dies or under-sized flash. Confirm the chip type, revision and flash density with esptool.py chip_id and flash_id, verify the MAC OUI is Espressif-assigned, measure the module against the official drawing, and run a link-margin or conducted transmit-power test on samples from each lot. MOQ is one reel (typically 1,000 pcs for this size module) or 50 pcs loose for prototypes; Shenzhen stock usually ships in 1-2 days.
Key Features
- Single-core 32-bit RISC-V at up to 160 MHz with 400 KB SRAM and 384 KB ROM
- Wi-Fi 802.11 b/g/n (1T1R, up to 150 Mbps) plus Bluetooth 5 LE with Long Range and mesh
- 4 MB flash inside the chip package - no separate SPI NOR device required
- Compact 13.2 x 16.6 x 2.4 mm module with 53 castellated pads and a PCB antenna
- Up to 15 GPIO, TWAI (CAN 2.0), USB Serial/JTAG, I2S, SAR ADC and LED PWM controller
Typical Applications
- ESP8266 replacements in smart plugs, bulbs, switches and appliance controllers
- Battery and mains-powered sensor nodes using BLE 5 Long Range
- Compact wearables and small form-factor IoT products where board area is scarce
- BLE provisioning plus Wi-Fi upload gateways for home and building automation
- USB Serial/JTAG debug dongles and low-cost connected peripherals
Specifications
- Wireless Standard
- Wi-Fi 802.11 b/g/n + Bluetooth 5 LE (Long Range, mesh)
- Frequency Band
- 2.4 GHz ISM (2412 to 2484 MHz)
- Core
- 32-bit RISC-V, single-core
- Max Clock
- 160 MHz
- Flash
- 4 MB
- SRAM
- 400 KB
- Antenna
- On-board PCB antenna
- VCC
- 3.0 to 3.6 V
- Pins
- 53
- RoHS
- Compliant
Procurement Tips
Order the v1.1 revision explicitly (ESP32-C3-MINI-1-N4X, or -H4X for 105 C) rather than the plain -N4, and confirm the revision with esptool on receipt - NRND v0.4 stock is still circulating at attractive prices.
Frequently Asked Questions
How does the ESP32-C3-MINI-1 compare with the ESP32-WROOM-32?
The WROOM-32 has two Xtensa LX6 cores at 240 MHz, 520 KB SRAM, Bluetooth 4.2 with BR/EDR and BLE, and a larger 18 x 25.5 mm body with 38 pads. The C3-MINI-1 has one RISC-V core at 160 MHz, 400 KB SRAM, Bluetooth 5 LE only (no classic BR/EDR), and a much smaller 13.2 x 16.6 mm body with 53 pads. Choose the WROOM-32 for dual-core compute or classic Bluetooth audio profiles, and the C3 for size, BLE 5 features and lower cost.
Can I migrate an ESP8266 (ESP-12F) design straight to the ESP32-C3-MINI-1?
Not pin-for-pin: the pad counts, dimensions and strapping pins differ, so a layout change is required. Firmware migration is more comfortable - ESP-IDF and the Arduino core both support the C3, and most ESP8266 application logic ports with changes to the Wi-Fi driver APIs and flash partition table. Espressif positions the C3 as the ESP8266 successor for exactly this reason.
What is the difference between the N4 and N4X variants?
The suffix reflects the embedded chip revision. -N4 modules use the older v0.4 ESP32-C3 chip and are marked NRND, while -N4X uses the recommended v1.1 revision with fixes and errata closure. The -H4X and -H8X variants are rated to 105 C ambient and the -H8X carries 8 MB of flash. For new designs specify -N4X (or -H4X/-H8X if you need the wider temperature or larger flash).
How much supply current should I budget for a battery design?
Receive is about 82 mA in Wi-Fi HT20 mode and transmit peaks near 350 mA at 20.5 dBm, while Bluetooth LE transmit at 20 dBm peaks around 340 mA. Design the regulator and cell for those peaks, add bulk capacitance at the module, and reduce duty cycle or transmit power where possible - the deep-sleep and modem-sleep paths are what make battery life practical.
How do I detect counterfeit ESP32-C3-MINI-1 modules?
Run esptool.py chip_id and flash_id: a genuine -N4X reports an ESP32-C3 with the expected revision and 4 MB flash. Verify the MAC OUI is Espressif-assigned, check the module dimensions (13.2 x 16.6 x 2.4 mm) and pad pattern against the datasheet drawing, inspect marking quality and reflow joints, and compare conducted transmit power against the 20.5 dBm typical figure. Copies often show wrong flash density, weak RF output or a v0.4 chip sold as v1.1.
What is the MOQ and lead time?
Prototype MOQ is 50 pcs loose; production is normally one reel (about 1,000 pcs) or multiples. Espressif authorised lead time is typically 4-8 weeks depending on chip revision availability. Our Shenzhen stock generally ships within 1-2 business days and can be supplied with lot codes and an esptool verification report.
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